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导热垫片DP-F2000

产品介绍DESCRIPTION

DP-F2000是一款性价比极高的缝隙填充导热垫片,该产品导热性能适中,其导热系数可达到2.0W/mK。同时,该产品可在-50℃到200℃的环境条件下,依然保持良好的性能,并且符合UL 94 V0标准。DP-F2000具有双面自粘性,使用时可直接贴于电子元器件上,操作方便。

DP-F2000 is a compliant elastomer gap filler designed to provide moderate thermal performance while remaining cost effective. Combining good thermal conductivity of 2.0W/mK with high conformability, this gap filler produces low thermal resistance. This gap filler is stable from -50℃ to 200℃ and meets UL 94 VO rating. DP-F2000 is offered with inherent natural tack on both sides of the material allowing for stick-in-place characteristics during application assembly.

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典型应用APPLICATIONS

半导体散热装置Semiconductors to heat sink

通讯设备Telecommunications equipment

显卡Graphics cards显卡

记忆存储模块Memory modules

照明设备LED solid state lightingLED

台式电脑,笔记本电脑,网络服务器Desktop computers, laptops, servers

电源设备Power electronics

LCD和等离子电视LCD and PDP flat panel TV



特点与优势FEATURES AND BENEFITS

热传导率可达2.0 W/mK u Thermal Conductivity 2.0W/mK

高柔顺性Soft and highly Compliant

低压力下就有较低的热阻Low thermal resistance at low pressure

优异的自粘性能Excellent adhesive properties