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Home
About Us
Company Profile
Company Culture
Honor
Company Events
News
Company News
Industry News
Products
Thermal Pad
Thermal Putty
Gap-Filler
Thermal Grease
Phase Change Materils
Bondply
Thermal Glue
Thermal Pouring Sealant
Conductive Glue
Electromagnetic Shielding Film
Thermoelectric Cooling Module
Human Resource
Talent Concept
Recruitment
Network
Message
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Customer demand is our unremitting pursuit
Thermal Pad
Thermal Putty
Gap-Filler
Thermal Grease
Phase Change Materils
Bondply
Thermal Glue
Thermal Pouring Sealant
Conductive Glue
Electromagnetic Shielding Film
Thermoelectric Cooling Module
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Thermal Pouring Sealant
环氧灌封胶
双组份室温或加热固化的环氧封胶,导热性能由低到高可选择。绝缘密封性强,可用于高强度适合粘接或低粘度适合灌封。
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有机硅灌封胶
导热率由中到高可选,有机硅基双组份液态胶,室温或加热固化,无腐蚀,可重工。
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