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Home
About Us
Company Profile
Company Culture
Honor
Company Events
News
Company News
Industry News
Products
Thermal Pad
Thermal Putty
Gap-Filler
Thermal Grease
Phase Change Materils
Bondply
Thermal Glue
Thermal Pouring Sealant
Conductive Glue
Electromagnetic Shielding Film
Thermoelectric Cooling Module
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Talent Concept
Recruitment
Network
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Thermal Pad
Thermal Putty
Gap-Filler
Thermal Grease
Phase Change Materils
Bondply
Thermal Glue
Thermal Pouring Sealant
Conductive Glue
Electromagnetic Shielding Film
Thermoelectric Cooling Module
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Conductive Glue
Conductive Glue
德邦点胶技术(FIP)是一种自动化系统,可以生产导电弹性体EMI屏蔽元件,并能将垫片附着在金属或塑料的基板上。点胶技术非常适用于手机、PDAS、PC卡、电信基础...
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