DP-F3000S是一款高导热性能且质软的缝隙填充导热垫片，该产品导热系数可达到2.8 W/mK，并且可在低压力下保持优良的导热性能。同时，该产品具有弹性体所固有的填充特性，适用于各种粗糙表面。DP-F3000S具有自粘性，无需额外涂覆其他粘结涂层，操作方便。

DP-F3000S is a 2.8 W/mK soft gap filler thermal interface material with great thermal performance and high compliancy. DP-F3000S is well suited for high performance in low-stress applications. And it maintains a conformable yet elastic nature that allows for excellent interfacing and wet-out characteristics, even to surfaces with high roughness or topography. Naturally tacky, it requires no additional adhesive coating to inhibit thermal performance.

半导体散热装置Semiconductors to heat sink

通讯设备Telecommunications equipment

显卡Graphics cards

记忆存储模块Memory modules 记忆存储模块

LED 照明设备 LED solid state lighting LED 照明设备

电源设备Power electronics 电源设备

LCD和等离子电视 LCLCD and PDP flat panel TV

热传导率可达3.5 W/mKThermal Conductivity 3.5W/mK

高柔顺性Soft and highly Compliant

低压力下就有较低的热阻Low thermal resistance at low pressure

优异的自粘性能，便于装配Naturally tacky for easy assembly