DB-F2000S是一款质软型缝隙填充导热垫片，由于其较软的硬度，使其可在低压力的情况下表现出较小的热阻，同时排除元器件和电路板之间的空气，并且充分填充各类粗糙的表面。

DB-F2000S is recommended for low-stress applications that require a mid to high thermally conductive interface material. “S-class” is ultra soft for low thermal resistance at very low pressures, and allows the pad to fill in air voids and air gaps between PC boards and heat sinks or metal chassis with stepped topography, rough surfaces and high stack-up tolerances.

半导体散热装置Semiconductors to heat sink

通讯设备Telecommunications equipment

显卡Graphics cards

记忆存储模块Memory modules

照明设备LED solid state lightingLED

台式电脑，笔记本电脑，网络服务器Desktop computers, laptops, servers

电源设备Power electronics

LCD和等离子电视LCD and PDP flat panel TV

热传导率可达2.5 W/mKThermal Conductivity 2.5W/mK

S为超软硬度级别"S-Class" for ultra soft hardness

广泛应用于低压力情况下Designed for low-stress applications

优异的自粘性能Excellent adhesive properties