DP-F3000是一款缝隙填充导热垫片，该产品的导热系数可达到3.0W/mK，并能在低压力的情况下表现出较小的热阻。同时，该产品较为柔软，可充分填充各类表面粗糙度的电子元器件。

DP-F3000 is a thermally conductive, reinforced material rated at a thermal conductivity of 3.0 W/mK, low thermal resistances can be achieved at low pressures. This soft interface pad conforms well to minimal pressure, resulting in excellent interfacing and wet-out characteristics, even to surfaces with high roughness and/or topography.

半导体散热装置Semiconductors to heat sink

通讯设备Telecommunications equipment

显卡Graphics cards

记忆存储模块Memory modules

照明设备LED solid state lighting LED

台式电脑，笔记本电脑，网络服务器Desktop computers, laptops, servers

电源设备Power electronics

LCD和等离子电视 LCLCD and PDP flat panel TV

热传导率可达3.0 W/mKThermal Conductivity 3.0W/mK

高柔顺性Soft and highly Compliant

低压力下就有较低的热阻Low thermal resistance at low pressure

优异的自粘性能Excellent adhesive properties