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导热垫片 DP-F3000

产品介绍DESCRIPTION

DP-F3000是一款缝隙填充导热垫片,该产品的导热系数可达到3.0W/mK,并能在低压力的情况下表现出较小的热阻。同时,该产品较为柔软,可充分填充各类表面粗糙度的电子元器件。

DP-F3000 is a thermally conductive, reinforced material rated at a thermal conductivity of 3.0 W/mK, low thermal resistances can be achieved at low pressures. This soft interface pad conforms well to minimal pressure, resulting in excellent interfacing and wet-out characteristics, even to surfaces with high roughness and/or topography.

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典型应用APPLICATIONS

半导体散热装置Semiconductors to heat sink

通讯设备Telecommunications equipment

显卡Graphics cards

记忆存储模块Memory modules

照明设备LED solid state lighting LED

台式电脑,笔记本电脑,网络服务器Desktop computers, laptops, servers

电源设备Power electronics

LCD和等离子电视 LCLCD and PDP flat panel TV



特点与优势FEATURES AND BENEFITS

热传导率可达3.0 W/mKThermal Conductivity 3.0W/mK

高柔顺性Soft and highly Compliant

低压力下就有较低的热阻Low thermal resistance at low pressure

优异的自粘性能Excellent adhesive properties