产品介绍DESCRIPTION

       DP-F5000G 是一款高导热性能且质软的缝隙填充导热垫片，该产品导热系数可达到6 W/mK，并且可在低压力下保持优良的导热性能。同时，该产品具有弹性体所固有的填充特性，适用于各种粗糙表面。DP-F5000G 具有自粘性，无需额外涂覆其他粘结涂层，操作方便。

        DP-F5000G is a thermally conductive,reinforced material rated at a thermal conductivity of about 6 W/mK, low thermal resistances can be achieved at low pressures. This soft interface pad conforms well to minimal pressure, resulting in excellent interfacing and wet-out characteristics, even to surfaces with high roughness and/or topography.DP-F5000G is naturally tacky, and no adhesive coating is required, to provide easy handling and converting process. 

典型应用APPLICATIONS

半导体散热装置Semiconductors to heat sink

通讯设备Telecommunications equipment

显卡Graphics cards

记忆存储模块Memory modules 记忆存储模块

LED 照明设备 LED solid state lighting LED 照明设备

电源设备Power electronics 电源设备

LCD和等离子电视 LCLCD and PDP flat panel TV

特点与优势FEATURES AND BENEFITS

热传导率可达6 W/mKThermal Conductivity 6W/mK

高柔顺性Soft and highly Compliant

低压力下就有较低的热阻Low thermal resistance at low pressure

优异的自粘性能，便于装配Naturally tacky for easy assembly